CoWoS shortages open the door for Chipzilla’s EMIB

The dark satanic rumour mill has manufactured a hell on earth yarn claiming that the Fruity Cargo Cult Apple is weighing up Intel’s chip packaging tech as bottlenecks at TSMC threaten to slow its bespoke AI server silicon ambitions.

Taiwanese outfit bets big on CoWoS, SoIC, and CoW fab in Arizona

TSMC is plotting another big move in its American push, this time with plans to manufacture some of its most advanced chip packaging tech in the US to loosen its dependency on Taiwan.

Intel plays the packaging card to keep customers 

Troubled Chipzilla has decided the path to foundry salvation runs straight through the packaging plant. It’s now shouting from the rooftops that its real ace in the silicon arms race isn’t process nodes but how it wraps the goods.

All ready for 2016

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016.