In case you missed it, KIOXIA's latest LC9 Enterprise SSD Series uses a 32-die stack of 2Tb BiCS FLASH QLC 3D flash, combined with CBA technology, which enables 8TB to be squeezed in a small 154 BGA package. The ability to put 8TB in a small 154 BGA package is one of the industry's first, thanks to KIOXIA's high-precision wafer processing, material design, and wire bonding technologies, according to the company.

“When customers evaluate SSDs, important consideration is given to storage that scales to high capacities while delivering high performance and low power consumption,” said Jay Kramer, Chair of the Awards Program and President of Network Storage Advisors Inc. “We are proud to recognize KIOXIA for its BiCS FLASH 3D flash memory and KIOXIA LC9 Series SSD. This solution is enabled by their CBA (CMOS directly Bonded to Array) technology and the innovation of a 32-die stacked architecture in a package - delivering the capacity, power and density required for transformational SSDs. Creating the highest capacity PCIe 5.0 enterprise SSD is a remarkable achievement and a clear reflection of Kioxia’s leadership position.”

Announced back in July, the KIOXIA LC9 Series Enterprise SSD lineup comes in 2.5-inch, E3.L, and E3.S form factors, and mostly aims at the demands of generative AI environments, thanks to the performance and efficiency it offers.