Samsung PM1743 hits 13.8 GBps throughput

Intel has been showing off how well its i9-12900K Alder Lake processor can work with Samsung's recently announced PM1743 PCIe 5.0 x4 SSD.

Regulators agree

South Korea's SK Hynix has finished the first phase of its acquisition of Intel Corp's NAND flash memory chip business after it received regulatory nods from eight countries including China.

Making Gelsinger an offer he can’t refuse

Chipzilla and Italy are intensifying talks over investments expected to be worth around 8 billion euros ($9 billion) to build an advanced semiconductor packaging plant.

In the Pooh after telling suppliers not to source from Xinjiang was a bad idea

Intel apologised to Chinese customers, partners and the public after a letter telling its suppliers not to source products or labour from the western region of Xinjiang caused a backlash.

Even if they were already working from home

Chipzilla is telling unvaccinated workers who don't get an exemption for religious or medical reasons will be on unpaid leave beginning in April even if they were working from home.

Thanks for the memory 

South Korea's SK Hynix  has received merger clearances from the Chinese antitrust authority for its acquisition of Intel NAND memory chip business.

Intel warns

Chipzilla boss chief Pat [kicking] Gelsinger has reiterated the global chip shortage is set to continue into 2023.

To deal with chip shortage

Intel is spending $7 billion to build a new chip packaging facility in Malaysia, a major Asian investment intended to address endemic global semiconductor shortages at a time Washington is advocating domestic production.

Intel could be onto something

The dark satanic rumour mill has manufactured a hell on earth yarn claiming that AMD could be planning on bringing in hybrid processors – chips that mix different types of cores.

Will gain market lead lost to TSMC

Research teams at Intel unveiled work that the company believes will help it keep speeding up and shrinking computing chips over the next ten years, with several technologies aimed at stacking parts of chips on top of each other.