While the dust hasn’t even settled on Blackwell Ultra, Huang has been spotted in Taiwan checking up on progress at TSMC. Speaking to local hacks, he let slip that six new Rubin chips have already been taped out, including CPUs, GPUs, switches, and a new photonics processor. In other words, Nvidia is overhauling its entire tech stack.

“My main purpose is to visit TSMC… we have a next-generation architecture called Rubin… and we have now taped out six brand new chips,” Huang said. All of these are now in TSMC’s fabs being prepped for trial production.

The new chips include a dedicated CPU, a scale-up NVLink switch, and a new silicon photonics processor, which implies NVIDIA is binning the old setup. Rubin is expected to shift from HBM3E to HBM4, move to TSMC’s 3nm N3P process, adopt CoWoS-L packaging, and introduce chiplet designs for the first time in NVIDIA’s product line.

It’s Hopper-meets-Blackwell-but-bigger, with a claimed 4x reticle design compared to Blackwell’s 3.3x.

According to Huang, the Rubin architecture will hit the market between 2026 and 2027, depending on how the trial production goes.

If the specs hold up, Rubin will be another generational leap and a proper shake-up for the AI and compute scene. Until then, NVIDIA’s churn continues at breakneck speed, and it looks like the Rubin revolution is already under construction.