Chipzilla still chasing TSMC with 18A foundry push
Published in News


Intel bangs the drum on 18A node

Troubled Chipzilla is still flogging its foundry turnaround plan, this time at its annual Direct Connect bash, where CEO Lip-Bu Tan and his top brass tried to convince the world that Intel Foundry Services is back on track.

Cloud-based security storms ahead as physical kit plays catch-up
Published in Cloud


AI threats and zero-trust mandates are driving a $26bn boom

Beancounters working for the Dell’Oro Group have added up some numbers and divided by their shoe size and worked out that while everyone is banking on about hardware cybersecurity, particularly of the cloudy sort, is where the cash is.

Infineon and Typhoon HIL team up on xEV development
Published in Transportation


TriBoard plug-in cuts time, cost and hassle for carmakers

Infineon has signed up with Typhoon HIL to make the lives of xEV powertrain developers a bit less miserable. The pair are promising a real-time hardware-in-the-loop (HIL) simulation setup that plugs straight into Infineon’s AURIX TC3x and TC4x microcontrollers.

Nvidia top boffin says US export bans boosted Huawei AI dev
Published in AI


Dally says US rules handed China a tech talent pipeline

Nvidia chief scientist Bill Dally [pictured] has suggested that the US export control ban on AI gear to China has helped Huawei and its mates in the Middle Kingdom rather than holding them back.

Coracer slaps graphene thermal pad on AMD AM5 chips
Published in News


Claims 130 W/m·K conductivity miracle

A mysterious outfit calling itself Coracer has chucked a new graphene thermal pad into the AM5 processor ring, claiming it’s a better option than thermal paste or liquid metal.