MediaTek releases Dimensity 7200
Published in Mobiles


A rival for Qualcomm’s Snapdragon 7 Gen 1

MediaTek has unveiled the Dimensity 7200, a new mid-range phone chipset which is believed to be targeted against Qualcomm’s Snapdragon 7 Gen 1.

Half of Apple's Indian made cases rejected
Published in Mobiles


China was much better

Apple's attempts to move its production from China to India got a swift kick up the bottom line after it discovered that more than half the cases made in the Indian plants were being rejected. 

Samsung Galaxy Z Fold 3 screens start to crack
Published in Mobiles


Just after the warranty expires

Samsung Galaxy Z Fold 3s have begun to surface showing the inner screen of the phone failing with a crack right down the middle, even when there is no visible damage or wear elsewhere on the phone.

Apple's software geniuses can't get fintec products to go
Published in Mobiles


Months late 

Fruity cargo-cult Apple appears to be having a cock-up in the programming department with several already announced fintec products failing to appear.

Apple takes revenge on EU's USB-C requirements
Published in Mobiles


We will limit what it can do

Fruity-cargo cult Apple is so angry that the EU forced it to dump its lightning port in favour of USB-C that it is introducing a limited version of the spec in its iPhone 15.